Substrate and preparation method thereof, display panel and preparation method thereof, and display device

ABSTRACT

A substrate and a preparation method thereof, a display panel and a preparation method thereof, and a display device are provided. The substrate includes a display region and a peripheral region positioned in a periphery of the display region and used for sealing, the substrate includes: a base substrate; an insulating layer, arranged on a side of the base substrate and positioned in the display region and the peripheral region for sealing; and a plurality of pixel units, positioned on the insulating layer corresponding to the display region, and in the peripheral region, at least one groove is disposed on a side of the insulating layer which faces away from the base substrate, a side of the groove which is away from the base substrate is open, and a depth direction of the groove is perpendicular to the base substrate.

TECHNICAL FIELD

Embodiments of the present disclosure relate to a substrate and apreparation method thereof, a display panel and a preparation methodthereof, and a display device.

BACKGROUND

A display panel may include an array substrate and an opposed substratewhich is opposite to the array substrate and is used for packaging andprotection. The array substrate includes a plurality of pixel units fordisplay and functional structures such as a driving circuit for drivingthe pixel units to emit light and the like. The opposed substrate isbonded with the array substrate by a sealant so as to provide packagingand protection for the pixel units and the functional structures such asthe driving circuit and the like on the array substrate.

SUMMARY

At least one embodiment of the present disclosure provides a substratecomprising a display region and a peripheral region positioned in aperiphery of the display region and used for sealing, the substratecomprises: a base substrate; an insulating layer, arranged on a side ofthe base substrate and positioned in the display region and theperipheral region for sealing; and a plurality of pixel units,positioned on the insulating layer corresponding to the display region,and in the peripheral region, at least one groove is disposed on a sideof the insulating layer which faces away from the base substrate, a sideof the groove which is away from the base substrate is open, and a depthdirection of the groove is perpendicular to the base substrate.

For example, in the substrate provided by at least one embodiment of thepresent disclosure, the peripheral region for sealing is a sealant setregion, and each of the plurality of pixel units includes: alight-emitting element layer which is arranged on a side of theinsulating layer which faces away from the base substrate and includes alight-emitting layer.

For example, in the substrate provided by at least one embodiment of thepresent disclosure, an extending direction of the groove is parallel toa plane where the base substrate is positioned, and on a planeperpendicular to the base substrate, a longitudinal cross-section of thegroove is of a regular trapezoid or inverted trapezoid shape.

For example, the substrate provided by at least one embodiment of thepresent disclosure further comprises: a pixel definition layerpositioned on the insulating layer corresponding to the display regionand includes a plurality of pixel openings for defining the plurality ofpixel units, the light-emitting layer at least covering the plurality ofpixel openings, and an extending direction of the groove is identicalwith an extending direction of the pixel opening.

For example, in the substrate provided by at least one embodiment of thepresent disclosure, a shape and a size of an end of the groove away fromthe base substrate are identical with shapes and sizes of ends of theplurality of pixel openings away from the base substrate; or the shapeof the end of the groove away from the base substrate is identical withthe shapes of the ends of the plurality of pixel openings away from thebase substrate, the size of the end of the groove away from the basesubstrate is greater than sizes of the ends of the plurality of pixelopenings away from the base substrate.

For example, in the substrate provided by at least one embodiment of thepresent disclosure, the insulating layer includes a plurality of groovesin the peripheral region, extending directions of the plurality ofgrooves are identical, the plurality of grooves are arranged into aplurality of rows and a plurality of columns in the periphery of thedisplay region, a row direction of the grooves is identical with a rowdirection of the plurality of pixel openings, and a column direction ofthe grooves is identical with a column direction of the pixel openings,a shape of an end of the groove away from the base substrate isidentical with shapes of ends of the plurality of pixel openings awayfrom the base substrate, sizes of the ends of the plurality of groovesaway from the base substrate are equal to sizes of the ends of theplurality of pixel openings away from the base substrate, or the sizesof the ends of at least one portion of the plurality of grooves awayfrom the base substrate are greater than the sizes of the ends of theplurality of pixel openings away from the base substrate.

For example, in the substrate provided by at least one embodiment of thepresent disclosure, the sizes of the ends of the plurality of groovesaway from the base substrate are equal to the sizes of the ends of theplurality of pixel openings away from the base substrate, the shapes ofthe plurality of grooves are identical and the sizes of the plurality ofgrooves are identical, a pitch of the grooves in the row direction isidentical with a pitch of the pixel openings in the row direction and/ora pitch of the grooves in the column direction is identical with that ofthe pixel openings in the column direction.

For example, in the substrate provided by at least one embodiment of thepresent disclosure, the plurality of grooves are divided into two groupsaccording to different lengths, a width of each of the plurality ofgrooves is equal to a width of the pixel opening, the length of a groovein one group of the two groups is equal to a sum of pitches of theplurality of pixel openings along the column direction, the grooves inthe one group of the two groups are arranged on both sides of thedisplay region along the row direction of the pixel opening, the lengthof a groove in other group of the two groups is equal to or greater thana length of each of the plurality of pixel openings, the grooves in theother group are arranged on both sides of the display region in thecolumn direction, and a pitch of the plurality of grooves along the rowdirection are identical with the pitch of the plurality of pixelopenings along the row direction.

For example, in the substrate provided by at least one embodiment of thepresent disclosure, a surface of the insulating layer which ispositioned in the peripheral region has lyophobicity.

For example, in the substrate provided by at least one embodiment of thepresent disclosure, at least one portion of the light-emitting layer ispositioned in the groove.

For example, in the substrate provided by at least one embodiment of thepresent disclosure, the insulating layer includes: a first subinsulating layer, having a first groove portion; and a second subinsulating layer, laminated on the first sub insulating layer and havingan opening communicating with the first groove portion, and the firstgroove portion and the opening constitutes the groove.

For example, in the substrate provided by at least one embodiment of thepresent disclosure, a longitudinal cross-section of the first grooveportion is of a regular trapezoid shape, and a longitudinalcross-section of the opening is of an inverted trapezoid or rectangleshape.

For example, in the substrate provided by at least one embodiment of thepresent disclosure, a material of the first sub insulating layerincludes a negative photoresist material, and a material of the secondsub insulating layer includes a positive photoresist material or aninorganic material.

For example, the substrate provided by at least one embodiment of thepresent disclosure further comprises a driving circuit positioned on thebase substrate in the display region and configured to drive theplurality of pixel units, and the insulating layer covers the drivingcircuit.

At least one embodiment of the present disclosure provides a displaypanel, the display panel comprises: the substrate as mentioned above; anopposed substrate, arranged to be opposite to the substrate; and asealant, disposed between the substrate and the opposed substrate, andthe sealant covers the groove and bonds the opposed substrate with thesubstrate.

At least one embodiment of the present disclosure provides a preparationmethod of a substrate, the substrate includes a display region and aperipheral region which is positioned in a periphery of the displayregion and used for sealing, the preparation method comprises: providinga base substrate; forming an insulating layer in the display region andthe peripheral region and on a side of the base substrate; and formingat least one groove in the peripheral region and on a side of theinsulating layer faces away from the base substrate, a side of thegroove away from the base substrate being open, a depth direction of thegroove being perpendicular to the base substrate, and the substrateincludes a plurality of pixel units, and the plurality of pixel unitsare positioned on the insulating layer corresponding to the displayregion.

For example, in the preparation method provided by at least oneembodiment of the present disclosure, the insulating layer is configuredthat at least a surface of the insulating layer in the peripheral regionhas lyophobicity.

For example, the preparation method provided by at least one embodimentof the present disclosure further comprises: forming a pixel definitionlayer, the pixel definition layer including a plurality of pixelopenings respectively used for the plurality of pixel units; and forminga light-emitting layer, the light-emitting layer at least covering theplurality of pixel openings, and the light-emitting layer is formed byusing an ink-jet printing, spin-coating or spray-coating mode, and atleast one portion of the light-emitting layer is formed in the groove.

For example, in the preparation method provided by at least oneembodiment of the present disclosure, the forming the insulating layerincludes: forming a first sub insulating layer, the first sub insulatinglayer having a first groove portion; and forming a second sub insulatinglayer on the first sub insulating layer, the second sub insulating layerhaving an opening communicating with the first groove portion, and thefirst groove portion and the opening constitute the groove.

For example, in the preparation method provided by at least oneembodiment of the present disclosure, the second sub insulating layer isformed by adopting a material with lyophobicity, or a surface of thesecond sub insulating layer which is positioned in the peripheral regionis subjected to surface treatment, so that the surface of the second subinsulating layer which is positioned in the peripheral region haslyophobicity.

For example, in the preparation method provided by at least oneembodiment of the present disclosure, the surface treatment is carriedout by adopting plasmas of Ar, N2, CF4 or O2.

At least one embodiment of the present disclosure provides a preparationmethod of the display panel, the preparation method of the display panelcomprises: manufacturing the substrate, the substrate being prepared byany of the preparation method as mentioned above; and providing anopposed substrate, and bonding the opposed substrate on the substrate bya sealant, and the sealant covers the groove.

At least one embodiment of the present disclosure provides a displaydevice, the display device comprises the display panel as mentionedabove.

BRIEF DESCRIPTION OF THE DRAWINGS

In order to clearly illustrate the technical solution of the embodimentsof the invention, the drawings of the embodiments will be brieflydescribed in the following; it is obvious that the described drawingsare only related to some embodiments of the invention and thus are notlimitative of the invention.

FIG. 1A is a cross-sectional schematic diagram of a display panel;

FIG. 1B is a plane schematic diagram of a display panel;

FIG. 2 is a schematic diagram of an enter path of impurities such aswater, oxygen and the like in a display panel;

FIG. 3A is a cross-sectional schematic diagram of another display panel;

FIG. 3B is a plane schematic diagram of another display panel;

FIG. 4 is a schematic diagram of an enter path of impurities such aswater, oxygen and the like in another display panel;

FIG. 5A is a cross-sectional schematic diagram of a substrate providedby some embodiments of the present disclosure;

FIG. 5B is a cross-sectional schematic diagram of a display panelprovided by some embodiments of the present disclosure;

FIG. 5C is a plane schematic diagram of a display panel provided by someembodiments of the present disclosure;

FIG. 6 is a plane schematic diagram of another display panel provided bysome embodiments of the present disclosure;

FIG. 7A is a cross-sectional schematic diagram of yet another substrateprovided by some embodiments of the present disclosure;

FIG. 7B is a cross-sectional schematic diagram of yet another displaypanel provided by some embodiments of the present disclosure;

FIG. 7C is a plane schematic diagram of yet another display panelprovided by some embodiments of the present disclosure;

FIGS. 8A to 8D are cross-sectional schematic diagrams of a display panelin the preparation process, as provided by some embodiments of thepresent disclosure;

FIG. 9 is a plane schematic diagram in which a plurality of displaypanels are simultaneously formed, as provided by some embodiments of thepresent disclosure; and

FIG. 10 is a schematic diagram of a display device provided by someembodiments of the present disclosure.

DETAILED DESCRIPTION

In order to make objects, technical details and advantages of theembodiments of the invention apparent, the technical solutions of theembodiment will be described in a clearly and fully understandable wayin connection with the drawings related to the embodiments of theinvention. It is obvious that the described embodiments are just a partbut not all of the embodiments of the invention. Based on the describedembodiments herein, those skilled in the art can obtain otherembodiment(s), without any inventive work, which should be within thescope of the invention.

Unless otherwise defined, all the technical and scientific terms usedherein have the same meanings as commonly understood by one of ordinaryskill in the art to which the present disclosure belongs. The terms,such as “first,” “second,” or the like, which are used in thedescription and the claims of the present disclosure, are not intendedto indicate any sequence, amount or importance, but for distinguishingvarious components. The terms, such as “comprise/comprising,”“include/including,” or the like are intended to specify that theelements or the objects stated before these terms encompass the elementsor the objects and equivalents thereof listed after these terms, but notpreclude other elements or objects. The terms, such as“connect/connecting/connected,” “couple/coupling/coupled” or the like,are not limited to a physical connection or mechanical connection, butmay include an electrical connection/coupling, directly or indirectly.The terms, “on,” “under,” “left,” “right,” or the like are only used toindicate relative position relationship, and when the position of theobject which is described is changed, the relative position relationshipmay be changed accordingly.

Generally speaking, in one type of structure of a display panel, anopposed substrate and an array substrate are bonded with each other by asealant, so that the opposed substrate and the sealant completelyisolate a pixel unit and functional structures such as a driving circuitand the like in a display region of the array substrate from theexternal environment so as to avoid a case that impurities such aswater, oxygen and the like enter the display region, thereby prolongingthe working life of the display panel. For example, FIG. 1A and FIG. 1Bshow an ideal display panel structure.

As shown in FIG. 1A and FIG. 1B, a display panel 1 has a display region1A and a peripheral region 1B for sealing the display region 1A, thedisplay panel 1 includes an array substrate 17 and an opposed substrate15, the array substrate 17 includes a base substrate 11 and a drivingcircuit 12, an insulating layer 13 and a light-emitting element layer 14on the base substrate 11, and the opposed substrate 15 is bonded on theinsulating layer 13 by a sealant 16 so as to be bonded on the arraysubstrate and carry out sealing on the display region 1A. As shown inFIG. 1A and FIG. 1B, the sealant 16 completely surrounds thelight-emitting element layer 14, and thus, the opposed substrate 15 andthe sealant 16 completely isolate the light-emitting element layer 14from the external environment.

According to the structure, as shown in FIG. 2, there are routes (shownas arrows on both upper and lower sides of the sealant 16) for theimpurities such as water, oxygen and the like to enter the displayregion 1A only on both the upper and lower sides of the sealant 16 inthe display panel 1, and thus, the display panel 1 has a good packagingeffect.

However, in an actual preparation process, as shown in FIG. 3A and FIG.3B, a portion of functional layers of the light-emitting element layer14 (for example, a light-emitting layer, a common electrode and thelike) often adopt a full-surface forming mode, and thus, not only thedisplay region is covered, but also the peripheral region may becovered. At the moment, in some examples, as shown in FIG. 3B, aplurality of display panels may be formed in a one-time preparationprocess. For example, the light-emitting element layer 14 includesstructures, such as a first electrode 141, a pixel definition layer 142with a plurality of pixel openings, a light-emitting layer 143 at leastformed in the plurality of pixel openings, a second electrode 144, apassivation layer 145 and the like. For example, the structures, such asthe light-emitting layer 143 and the like, in the light-emitting elementlayer 14 adopt a full-surface forming mode, as shown in FIG. 3A, so thatthe light-emitting layer 143 is also formed in the peripheral region 2for sealing, resulting in that when the opposed substrate 15 is formedby adopting the sealant 16 at the later stage, the sealant 16 is formed(for example, coated) on the light-emitting layer 143 without directcontact with the insulating layer 13.

As shown in FIG. 4, under the case, routes for the impurities such aswater, oxygen and the like to enter the display region 1A are alsoformed on the light-emitting layer 143 in the peripheral region 1B andon both upper and lower sides of the light-emitting layer 143 in thedisplay panel, so that the packaging effect of the display panel isreduced.

At least one embodiment of the present disclosure provides a substrate,including a display region and a peripheral region positioned in theperiphery of the display region and used for sealing. The substrateincludes: a base substrate; an insulating layer, arranged on a side ofthe base substrate and positioned in the display region and theperipheral region for sealing; and a plurality of pixel units,positioned on the insulating layer corresponding to the display region,wherein in the peripheral region, at least one groove is disposed on aside of the insulating layer, which faces away from the base substrate,a side of the groove, which is away from the base substrate, is open,and a depth direction of the groove is perpendicular to the basesubstrate.

At least one embodiment of the present disclosure provides a preparationmethod of a substrate. The substrate includes a display region and aperipheral region positioned in the periphery of the display region andused for sealing. The preparation method includes: providing a basesubstrate; forming an insulating layer in a display region and aperipheral region and on a side of the base substrate; and forming atleast one groove in the peripheral region and on a side of theinsulating layer, which faces away from the base substrate, a side ofthe groove, which is away from the base substrate, being open, a depthdirection of the groove being perpendicular to the base substrate,wherein the substrate includes a plurality of pixel units, and theplurality of pixel units are positioned on the insulating layercorresponding to the display region.

At least one embodiment of the present disclosure provides a displaypanel, and the display panel includes the above-mentioned substrate.

At least one embodiment of the present disclosure provides a displaydevice, and the display device includes the above-mentioned displaypanel.

The substrate and the preparation method thereof, the display panel andthe preparation method thereof and the display device of the presentdisclosure will be illustrated below by several specific embodiments.

At least one embodiment of the present disclosure provides a displaypanel, FIG. 5A is a cross-sectional schematic diagram of a substrate1000, and FIG. 5C is a plane schematic diagram of the display panel,wherein FIG. 5B is a cross-sectional schematic diagram of the displaypanel in FIG. 5C along an A-A line.

The display panel includes an array substrate and an opposed substrate,the array substrate includes a base substrate, a driving circuit formedon the base substrate, an insulating layer covering the driving circuitand a light-emitting element layer on the insulating layer, and theopposed substrate is bonded on the insulating layer of the arraysubstrate in a peripheral region by a sealant so as to carry out sealingon a display region. The display region includes a plurality of pixelunits, and in each pixel unit, the driving circuit includes a pixeldriving circuit, the light-emitting element layer includes alight-emitting element, and the pixel driving circuit drives thelight-emitting element electrically connected therewith to emit light.

As shown in FIGS. 5B and 5C, the substrate 1000 includes the displayregion 10 and the peripheral region 11 positioned in the periphery ofthe display region and used for sealing, and the substrate 1000includes: the base substrate 101; the insulating layer 103, which isarranged on a side of the base substrate 101 and positioned in thedisplay region and the peripheral region for sealing; and a plurality ofpixel units, which are positioned on the insulating layer 103corresponding to the display region, wherein in the peripheral region,at least one groove 103A is disposed on a side of the insulating layer,which faces away from the base substrate, a side of the groove 103A,which is away from the base substrate 101, is open, and a depthdirection of the groove 103A is perpendicular to the base substrate.

For example, in the embodiment, the peripheral region for sealing is asealant disposing region, and each of the plurality of pixel units(R/G/B) includes: the light-emitting element layer 104, which isarranged on a side of the insulating layer 103, which faces away from abase, and includes a light-emitting layer 1043.

For example, in the embodiment, the substrate 1000 further includes apixel definition layer 1042, the pixel definition layer 1042 includes aplurality of pixel openings 1042A respectively used for the plurality ofpixel units, the light-emitting layer 1043 at least covers the pluralityof pixel openings 1042A, i.e., the plurality of pixel units share thelight-emitting layer 1043, or the plurality of pixel units areseparately provided with the respective light-emitting layers, and theembodiments of the present disclosure do not make any limit to it. Forexample, corresponding to each pixel unit, the light-emitting elementlayer 104 further includes a first electrode 1041 and a second electrode1044 for driving the light-emitting layer 1043 to emit light, i.e., thefirst electrode 1041, the second electrode 1044 and the light-emittinglayer 1043 sandwiched therebetween constitute a light-emitting element,and the light-emitting layer may be an organic light-emitting layer or aquantum dot light-emitting layer, and thus, the obtained light-emittingelement may be an Organic Light-Emitting Diode (OLED) or a Quantum dotLight-Emitting Diode (QLED). Moreover, the light-emitting element layer104 further may include a passivation layer 1045 covered on thelight-emitting layer 1043 so as to form packaging and protection.

For example, in this embodiment, an extending direction of the groove isparallel to a plane where the base is positioned, and on a planeperpendicular to the base, a longitudinal cross-section of the groove isof a regular trapezoid or inverted trapezoid shape.

For example, the longitudinal cross-section of the groove 103A may be ofa regular trapezoid shape with a narrow upper portion and a wide lowerportion (a trapezoid of which a bottom edge is longer than a top edge),so that the groove 103A can have a high volume. In addition, as shown inFIG. 5A, the longitudinal cross-section of the groove 103A also may beof an inverted trapezoid shape with a wide upper portion and a narrowlower portion (a trapezoid of which a bottom edge is shorter than a topedge), so as to benefit to fluid inflow. In some embodiments, the groove103A further may be of a shape of a rectangular with the same width ofthe upper and lower portions and the like, and the embodiments of thepresent disclosure do not make specific limit to it.

For example, in the preparation process of the display panel provided bysome embodiments of the present disclosure, the light-emitting layer1043 is formed by using a full-surface forming mode and for example, byusing printing modes of ink-jet printing, spin-coating, spray-coatingand the like, and thus, a material of the light-emitting layer 1043 canflow to the peripheral region 11 for sealing, and at the moment, thegroove 103A in the insulating layer 103 may collect the material of thelight-emitting layer 1043, which flows to the peripheral region 11, sothat the material of the light-emitting layer 1043, which is remained onthe insulating layer 103 in the peripheral region 11, is reduced, thematerial of the light-emitting layer 1043 cannot be remained on theinsulating layer 103 in the peripheral region 11, or residual portionsof the material of the light-emitting layer 1043 are spaced from eachother, and thus, a path for impurities such as water, oxygen and thelike to enter the display region 10 is disconnected. It will beillustrated below by taking a case that the material of thelight-emitting layer cannot remain on the insulating layer 103 in theperipheral region 11 as an example. At the moment, in some embodiment,the light-emitting layer 1043 at least partially extends into the groove103A.

For example, in the embodiment, a surface of the insulating layer 103,which is positioned in the peripheral region 11, has lyophobicity. Forexample, the insulating layer 103 is formed by adopting a material withlyophobicity, or the surface of the insulating layer 103, which ispositioned in the peripheral region 11, is subjected to surfacetreatment so as to have lyophobicity. At the moment, the surface of theinsulating layer 103, which has lyophobicity, can promote the materialof the light-emitting layer 1043 to flow into the groove 103A, so thatthe material of the light-emitting layer 1043, which flows to theperipheral region 11, sufficiently flows into the groove 103A and isaccommodated in the groove 103A, thereby ensuring that the material ofthe light-emitting layer 1043 may not be remained on the insulatinglayer 103 in the peripheral region 11.

For example, in some embodiments, as shown in FIG. 5B, the groove 103Aand the pixel opening 1042A are the same in plane shape and size, theplane shape herein refers to a shape of uppermost portions of the grooveand the pixel opening, and that is to say, the plane shape and sizeherein refer to a plane shape and a size of an end of the groove whichis away from the substrate and plane shapes and sizes of ends of theplurality of pixel openings which is away from the substrate, that is, aplane shape and a size of upper ends of the groove and the plurality ofpixel openings. Or, as shown in FIG. 6, the shape of an end of thegroove which is away from the base is the same with that of ends of theplurality of pixel openings which are away from the base, the plane sizeof the groove 103A is greater than that of the pixel opening 1042A, andfor example, a length and/or a width of the groove 103A is greater thana length and/or a width of the pixel opening 1042A. In the embodimentsof the present disclosure, the plane shapes of the groove 103A and thepixel opening 1042A refer to shapes of the groove 103A and the pixelopening 1042A, which are shown in plane diagrams of the groove 103A andthe pixel opening 1042A, i.e., shapes of the uppermost portions of thegroove 103A and the pixel opening 1042A, for example, as shown in FIG.5C and FIG. 6, the plane shapes of the groove 103A and the pixel opening1042A are rectangles, in other embodiments, the plane shapes of thegroove 103A and the pixel opening 1042A also may be circles, ovals orirregular shapes and the like, and the embodiments of the presentdisclosure do not make any specific limit to it. The plane sizes of thegroove 103A and the pixel opening 1042A refer to sizes (for example, alength, a width and the like) of the shapes of the groove 103A and thepixel opening 1042A, which are shown in the plane diagrams of the groove103A and the pixel opening 1042A, i.e., the shapes of the uppermostportions of the groove 103A and the pixel opening 1042A, at the samedimension, e.g., the sizes of the length and the width of the rectangleshape or an area of the rectangle shape, as shown in FIG. 5C and FIG. 6.In this embodiment, the plane shapes and the plane sizes of the groove103A and the pixel opening 1042A may be selected according to actualdemands, for example, in some embodiments, the plane size of the groove103A also may be smaller than that of the pixel opening 1042A, and theembodiments of the present disclosure do not make any specific limit toit.

For example, in some embodiments, the insulating layer 103 includes aplurality of grooves 103A in the peripheral region 11, and the pluralityof grooves 103A are arranged around the display region 10. The pluralityof grooves are the same in an extending direction, the plurality ofgrooves are arranged into a plurality of rows and a plurality of columnsin the periphery of the display region, a row direction of the groovesis the same with that of the plurality of pixel openings, a columndirection of the grooves is the same with that of the pixel opening, theshapes of ends of the plurality of grooves which are away from the baseare the same and are also the same with those of ends of the pluralityof pixel openings which are away from the base, the sizes of the ends ofthe plurality of grooves which are away from the base are all equal tothose of the ends of the plurality of pixel openings which are away fromthe base, or the sizes of ends of at least one portion of the pluralityof grooves which are away from the base are greater than those of theends of the plurality of pixel openings which are away from the base,and for example, the sizes of one portion are equal to those of thepixel openings, and the sizes of the other portion are greater than orsmaller than those of the pixel openings; or all the sizes of thegrooves are greater than or smaller than those of the pixel openings;and the sizes of one portion are equal to those of the pixel openings,the sizes of another portion are smaller than those of the pixelopenings, and the sizes of the rest portions are greater than those ofthe pixel openings.

For example, as shown in FIG. 5B, the sizes of the ends of the pluralityof grooves which are away from the base are equal to those of the endsof the plurality of pixel openings which are away from the base, i.e.,the lengths and the widths of the upper portions of the plurality ofgrooves are equal to the lengths and the widths of the upper portions ofthe pixel openings; the plurality of grooves are the same in shape andsize; a pitch 10501 of the grooves in a row direction is the same with apitch 10500 of the pixel openings in the row direction and/or a pitch ofthe grooves in a column direction is the same with a pitch of the pixelopenings the column direction; a pitch of the grooves positioned atedges on both left and right sides of the pixel units may be regarded asa pitch between the groove and the pixel opening, and that is to say, asshown in FIG. 5C, the plurality of pixel openings 1042A are arranged ina first array, the plurality of grooves 103A are arranged in a secondarray, the first array and the second array have the same arrangementdirection and have the same pitch in the arrangement direction, i.e.,the plurality of pixel openings 1042A and the plurality of grooves 103Aadopt the basically same arrangement mode. For example, when the planeshapes of the groove 103A and the pixel opening 1042A are rectangles,the rectangles are the same in a length extending direction and a widthextending direction, a spacing between the adjacent grooves 103A isbasically the same with that between the adjacent pixel opening 1042A,the spacing herein refers to a distance between edges of the adjacentgrooves in the row direction or the column direction, and the pitchrefers to a distance between centers of the adjacent grooves in the rowdirection or the column direction. Viewing from the plane diagram, thegroove and the pixel opening constitute the array together, the grooveand the pixel opening constitute an unit of the array together, andpitches between the units are the same. Viewing from the plane diagram,the pitch of the grooves are the same with those of the pixel openings,so that an apparatus parameters and a process parameter, e.g., a steppitch, a nozzle pitch and the like, of the light emitting layer andother light-emitting functional layers do not need to be transformed,and the light-emitting layer in the sealant set region can all fall intothe groove, thereby achieving an excellent sealing effect.

Optionally, it may be that the pitch, shape and size of a portion of thegrooves are the same with those of the pixel openings, so that a portionof the light-emitting layer in the sealant set region can all fall intothe groove, the sealing effect also can be improved, and the embodimentsof the present disclosure do not make any limit to it.

Optionally, the size and the shape of a random position of the groovemay be equal to the sizes and the shapes of corresponding positions ofthe plurality of pixel openings, for example, the size and the shape ofa middle depth position of the groove is equal to the size and the shapeof the middle depth position of the pixel opening, and those skilled inthe art may set as required.

For further example, as shown in FIG. 6, the second array formed by theplurality of grooves 103A is different from the first array formed bythe plurality of pixel openings 1042A, the plane size of the groove 103Ais different from that of the pixel opening 1042A, and the pitch of thearray also may be different. The plurality of grooves are divided intotwo groups according to the length, the widths of the plurality ofgrooves are equal to that of the pixel opening, the lengths of thegrooves of one of the two groups are equal to or slightly smaller than asum of the pitches of the plurality of pixel openings along the columndirection, the one group of grooves are arranged on both sides of thedisplay region along the row direction of the pixel opening, the lengthsof the grooves of the other group of the two groups are equal to orgreater than those of the plurality of pixel openings, the other groupof grooves are arranged on both sides of the display region in thecolumn direction, the pitch of the plurality of grooves along the rowdirection is the same with that of the plurality of pixel openings alongthe row direction, and herein, the pitch of the grooves positioned atedges of both the left and right sides of the pixel units may beregarded as the pitch between the groove and the pixel opening.

Optionally, in the second array including the plurality of grooves 103A,the plurality of grooves 103A may be arranged in an irregular row andcolumn mode, and for example, the grooves 103A in the adjacent rows arestaggered with each other by half the length in the row direction.

Under the above-mentioned setting, when the light-emitting layer 1043 isformed in the pixel opening 1042A, the groove 103A in the peripheralregion 11 can collect the material of the light-emitting layer 1043formed on the insulating layer 103 in the peripheral region 11 so as toavoid or reduce the material of the light-emitting layer 1043, which isremained on the insulating layer 103 in the peripheral region 11.

For example, in the embodiments of the present disclosure, a material ofthe insulating layer 103 includes inorganic materials such as SiOx,SiNx, Al₂O₃ and the like, or includes organic materials such aspolyimide (PI), polyacrylate or phenolic resin and the like, and theembodiments of the present disclosure do not make any specific limit toit.

As shown in FIG. 5A, for example, the substrate provided by theembodiments of the present disclosure further includes the basesubstrate 101 and the driving circuit 102. The base substrate 101 isused for supporting structures and members in the display region 10 andthe peripheral region 11; and the driving circuit 102 is positioned onthe base substrate 101 and used for driving a plurality of pixel units.For example, the driving circuit 102 includes the pixel driving circuitfor the pixel unit, the pixel driving circuit includes structures suchas a thin film transistor, a capacitor and the like, may be formed in aform of 2T1C (i.e., two transistors and one capacitor) and also may beformed in a form of 3T1C and the like, for example, when alight-emitting member of a light-emitting member layer is driven to emitlight, functions of compensation, resetting and the like also may beprovided, the driving circuit 102 further includes signal lines such asa gate line, a data line and the like, and the embodiments of thepresent disclosure do not make any limit to it.

For example, the insulating layer 103 covers the driving circuit 102 soas to protect the driving circuit 102 and planarize the driving circuit102.

In the display panel provided by some embodiments of the presentdisclosure, the insulating layer 103 includes the groove 103A in theperipheral region 11, and thus, the groove 103A can collect the materialof the light-emitting layer 1043. For example, in some embodiments, thesecond electrode 1044 and the passivation layer 1045 on thelight-emitting layer 1043 also may adopt a full-surface forming mode,and thus, there also may be materials of the second electrode 1044 andthe passivation layer 1045 in the groove 103A. Therefore, an undesiredmaterial such as the material of the light-emitting layer 1043 and thelike cannot remain for example on the insulating layer 103 in theperipheral region 11, so that the sealant 106 can be directly adheredbetween the insulating layer 103 and the opposed substrate 105 to formbetter sealing and bonding effects, and for example, compared to a casethat the undesired material is remained on the insulating layer 103 inthe peripheral region 11 to form a path for the impurities such aswater, oxygen and the like to enter the display region, an enter path ofwater, oxygen and the like can be reduced. In another aspect, thesealant 106 also may be at least partially filled into the groove 103A,and the formation of the groove 103A also complicates an enter path ofthe impurities such as water, oxygen and the like below the sealant 106,thereby further reinforcing the sealing effect.

For example, in some embodiments, in order to increase the volume of thegroove, the insulating layer may adopt a double-layer structure, and thegroove is formed in the double-layer structure. This setting can furtherensure that the undesired material cannot remain for example on theinsulating layer in the peripheral region. In another aspect, in a casethat a total volume of a plurality of grooves is constant, this settingcan reduce the forming number of the grooves.

For example, as shown in FIG. 5B, the display panel provided by someembodiments of the present disclosure includes the substrate 1000, theopposed substrate 105 and the sealant 106, the opposed substrate is setto be opposite to the substrate, the sealant 106 is set between thesubstrate and the opposed substrate and for example, covers the groove103A, and in the peripheral region, the opposed substrate 105 and thesubstrate 1000 are bonded to form the display panel 100 and the sealingis achieved.

For example, at least one embodiment of the present disclosure providesa substrate 2000, FIG. 7A is a cross-sectional schematic diagram of thesubstrate, FIG. 7B is a cross-sectional schematic diagram of a displaypanel including the substrate, and FIG. 7C is a plane schematic diagramof the display panel, wherein FIG. 7A is a cross-sectional schematicdiagram of the display panel in FIG. 7C along a B-B line.

As shown in FIG. 7A, FIG. 7B and FIG. 7C, the substrate 2000 has adisplay region 20 and a peripheral region 21 for sealing, and thesubstrate 2000 includes an insulating layer 203 in the display region 20and the peripheral region 21. The insulating layer 203 includes a groove203A in the peripheral region 21, a light-emitting element layer 204 fora plurality of pixel units (R/G/B) is formed in the display region 20and on the insulating layer 203, and the light-emitting element layer204 includes a light-emitting layer 2043.

For example, the insulating layer 203 includes a first sub insulatinglayer 2031 and a second sub insulating layer 2032 laminated on the firstsub insulating layer 2031. The first sub insulating layer 2031 has afirst groove portion 2031A, the second sub insulating layer 2032 islaminated on the first sub insulating layer 2031 and has an opening2032A communicating with the first groove portion 2031A, and the firstgroove portion 2031A and the opening 2032A constitute the groove 203Atogether. For example, a longitudinal cross-section of the first grooveportion 2031A is of a regular trapezoid shape, and a longitudinalcross-section of the opening 2032A is of an inverted trapezoid orrectangle shape, so that the groove 203A has a large volume.

For example, as shown in FIG. 7A, the longitudinal cross-section of theopening 2032A is of an inverted trapezoid shape with a wide upperportion and a narrow lower portion, and the longitudinal cross-sectionof the first groove portion 2031A is of a regular trapezoid shape with anarrow upper portion and a wide lower portion. For example, a size of alower end of the opening 2032A is basically the same with that of anupper end of the first groove portion 2031A, and thus, a cross-sectionof the obtained groove 203A is of an hourglass shape. In thisembodiment, the groove 203A has a larger volume, and compared to thecase shown in FIG. 5A for example, an enter path of the impurities suchas water, oxygen and the like is more complex.

In some embodiments, for example, a material of the first sub insulatinglayer 2031 includes a negative photoresist material so as to benefit forforming the first groove portion 2031A which has the narrow upperportion and the wide lower portion and has a larger volume in thepreparation process. A material of the second sub insulating layer 2032includes a positive photoresist material or includes an inorganicmaterial. For example, the negative photoresist material includesphenolic resin and the like, the positive photoresist material includespolyimide, polyacrylate and the like, and the inorganic materialincludes SiOx, SiNx, Al₂O₃ and the like. When the photoresist materialexposes, an exposing amount of a material on a surface layer is larger,and thus, after development, due to different exposure intensities ofupper and lower portions, a longitudinal cross-section which is of atrapezoid shape with a bevel edge is formed.

For example, in some embodiments of the present disclosure, thesubstrate further includes a pixel definition layer 2042, the pixeldefinition layer 2042 includes a plurality of pixel openings 2042Arespectively used for defining a plurality of pixel units, thelight-emitting layer 2043 at least covers the plurality of pixelopenings 2042A. For example, the light-emitting element layer 204further includes a first electrode 2041 and a second electrode 2044 fordriving the light-emitting layer 2043 to emit light, and furtherincludes a passivation layer 2045 which may be covered on thelight-emitting layer 2043 so as to form packaging and protection.

For example, in the preparation process of the display panel provided bysome embodiments of the present disclosure, the light-emitting layer2043 is formed by using a full-surface forming mode and for example, byusing printing modes of ink-jet printing, spin-coating, spray-coatingand the like, and thus, a material of the light-emitting layer 2043 canflow into the peripheral region 21 for sealing, and at the moment, thegroove 203A in the insulating layer 203 can collect the material of thelight-emitting layer 2043, which flows into the peripheral region 21, sothat the material of the light-emitting layer 2043 cannot remain forexample on the insulating layer 203 in the peripheral region 21. At themoment, in some embodiment, the light-emitting layer 2043 at leastpartially extends into the groove 203A.

For example, in some embodiments of the present disclosure, a surface ofthe insulating layer 203, which is positioned in the peripheral region21, has lyophobicity. For example, the first sub insulating layer 2031of the insulating layer 203 is formed by adopting a material withlyophobicity, or a surface of the first sub insulating layer 2031, whichis positioned in the peripheral region 21, is subjected to surfacetreatment so as to have lyophobicity. At the moment, the surface of theinsulating layer 203, which has lyophobicity, can promote the materialof the light-emitting layer 2043 to flow into the groove 203A, so thatthe material of the light-emitting layer 2043, which flows to theperipheral region 21, sufficiently flows into the groove 203A, therebyensuring that the material of the light-emitting layer 2043 cannot beremained on the insulating layer 203 in the peripheral region 21.

For example, in some embodiments of the present disclosure, the groove203A and the pixel opening 2042A are the same in plane shape and size,or the plane size of the groove 203A is greater than that of the pixelopening 2042A. In this embodiment, the plane shape of the groove 203Arefers to a shape of the second sub insulating layer 2032 in an upperlayer of the groove 203A, which is shown in the plane diagram of thegroove 203A, i.e., a plane shape of the uppermost portion of the secondsub insulating layer 2032, and a plane shape of the pixel opening refersto a shape of the pixel opening shown in the plane diagram of the pixelopening, that is, a shape of the uppermost portion of the pixel opening,for example, as shown in FIG. 7C, the plane shapes of the groove 203Aand the pixel opening 2042A are rectangles, and in other embodiments,the plane shapes of the groove 203A and the pixel opening 2042A also maybe circles, ovals or irregular shapes and the like, and the embodimentsof the present disclosure do not make any specific limit to it. Theplane size of the groove 203A refers to an area occupied by the shape ofthe second sub insulating layer 2032 in the upper layer of the groove203A, which is shown in the plane diagram of the groove 203A, the planesize of the pixel opening 2042A refers to a size (for example, a length,a width and the like) of the shape of the pixel opening 2042A, which isshown in the plane diagram of the pixel opening 2042A, at the samedimension, e.g., the sizes of the length and the width of the rectangleshape or the area of the rectangle shape, as shown in FIG. 7. In theembodiments of the present disclosure, the plane shapes and the planesizes of the groove 203A and the pixel opening 2042A may be selectedaccording to actual demands, for example, in some embodiments, the planesize of the groove 203A also may be smaller than that of the pixelopening 2042A, and the embodiments of the present disclosure do not makeany specific limit to it.

For example, in some embodiments, the insulating layer 203 includes aplurality of grooves 203A in the peripheral region 21, and the pluralityof grooves 203A are arranged around the display region 20. For example,the plurality of pixel openings 2042A are arranged in a first array, theplurality of grooves 203A are arranged in a second array, the firstarray and the second array have the same arrangement direction and havethe same pitch in the arrangement direction, i.e., the plurality ofpixel openings 2042A and the plurality of grooves 203A adopt thebasically same arrangement mode. For example, when the plane shapes ofthe groove 203A and the pixel opening 2042A are rectangles, an extendingdirection of a length of the rectangle of the groove 203A is the samewith an extending direction of a length of the rectangle of the pixelopening 2042A, and an extending direction of a width of the rectangle ofthe groove 203A is the same with an extending direction of a width ofthe rectangle of the pixel opening 2042A, and a spacing between theadjacent grooves 203A is basically the same with that between theadjacent pixel opening 2042A.

Under the above-mentioned setting, when the light-emitting layer 2043 isformed in the pixel opening 2042A, the groove 203A in the peripheralregion 21 can better collect the material of the light-emitting layer2043 formed on the insulating layer 203 in the peripheral region 21 soas to ensure that the material of the light-emitting layer 2043 cannotremain for example on the insulating layer 203 in the peripheral region21.

For example, the substrate 2000 provided by this embodiment furtherincludes a base substrate 201 and a driving circuit 202. The basesubstrate 201 is used for supporting the display region 20 and theperipheral region 21; and the driving circuit 202 is positioned on thebase substrate 201 and used for driving a plurality of pixel units. Forexample, the driving circuit 202 includes a pixel driving circuit forthe pixel unit, the driving circuit includes structures such as a thinfilm transistor, a capacitor and the like and may be formed in a form of2T1C, 3T1C and the like, and the embodiments of the present disclosuredo not make any limit to it. For example, the insulating layer 203covers the driving circuit 202 so as to protect the driving circuit 202.For example, the first sub insulating layer 2031 of the insulating layer203 is positioned on the driving circuit 202 and planarizes the drivingcircuit 202, and the second sub insulating layer 2032 is positioned onthe first sub insulating layer 2031 for forming the groove 203A.

For example, a display panel 200 provided by some embodiments of thepresent disclosure includes the substrate 2000, an opposed substrate 205and a sealant 206, the opposed substrate is set to be opposite to thesubstrate, and the sealant 206 is disposed between the substrate and theopposed substrate and for example, covers the groove 203A and bonds thesubstrate 2000 with the opposed substrate 205 together.

The first substrate 1000 and the second substrate 2000 are different inthe structure of the insulating layer, and are all the same in othermembers and structures, which are not repeated herein and may refer torelated descriptions in the first substrate 1000.

In the substrate and the display panel provided by some embodiments ofthe present disclosure, the insulating layer 203 includes the groove203A with the double-layer structure in the peripheral region 21, andthus, the groove 203A can collect the material of the light-emittinglayer 2043. For example, in some embodiments, the second electrode 2044and the passivation layer 2045 on the light-emitting layer 2043 also mayadopt a full-surface forming mode, and thus, there also may be materialsof the second electrode 2044 and the passivation layer 2045 in thegroove 203A. Therefore, the undesired material such as the material ofthe light-emitting layer 2043 and the like cannot be remained forexample on the insulating layer 203 in the peripheral region 21, so thatthe sealant 206 can be directly adhered between the insulating layer 203and the opposed substrate 205 to form better sealing, and for example,compared to a case that the undesired material is remained on theinsulating layer 203 in the peripheral region 21, an enter path of theimpurities such as water, oxygen and the like can be reduced. In anotheraspect, the formation of the groove 203A also complicates the enter pathof the impurities such as water, oxygen and the like below the sealant206, thereby further reinforcing the sealing effect.

At least one embodiment of the present disclosure provides a preparationmethod of a display panel. The preparation method includes: forming adisplay region and a peripheral region for sealing; and the forming thedisplay region and the peripheral region for sealing includes: formingan insulating layer in the display region and the peripheral region,forming a groove in the insulating layer in the peripheral region, andforming a light-emitting element layer for a plurality of pixel units onthe insulating layer in the display region, the light-emitting elementlayer including a light-emitting layer.

An embodiment of the present disclosure further provides a preparationmethod of a substrate. The substrate includes a display region and aperipheral region positioned in the periphery of the display region andused for sealing. The preparation method includes: providing a basesubstrate; forming an insulating layer in the display region and theperipheral region on a side of the base substrate; and forming at leastone groove in the peripheral region and on a side of the insulatinglayer which faces away from the base substrate, a side of the groove,which is away from the base substrate, being open, a depth direction ofthe groove being perpendicular to the base substrate, wherein thesubstrate includes a plurality of pixel units, and the plurality ofpixel units are positioned on the insulating layer corresponding to thedisplay region.

For example, the insulating layer is configured that at least a surfaceof the insulating layer in the peripheral region is lyophobic.

For example, the preparation method of the substrate further includes:forming a pixel definition layer, the pixel definition layer including aplurality of pixel openings respectively used for the plurality of pixelunits; and forming a light-emitting layer, the light-emitting layer atleast covering the plurality of pixel openings, wherein thelight-emitting layer is formed by using an ink-jet printing,spin-coating or spray-coating mode, and at least one portion of thelight-emitting layer is formed in the groove.

For example, the forming the insulating layer includes: forming a firstsub insulating layer, the first sub insulating layer having a firstgroove portion; and forming a second sub insulating layer on the firstsub insulating layer, the second sub insulating layer having an openingcommunicating with the first groove portion, wherein the first grooveportion and the opening constitute the groove.

For example, the second sub insulating layer is formed by adopting amaterial with lyophobicity, or a surface of the second sub insulatinglayer, which is positioned in the peripheral region, is subjected tosurface treatment, so that the surface of the second sub insulatinglayer, which is positioned in the peripheral region, has lyophobicity.

For example, the surface treatment is carried out by adopting plasmas ofAr, N₂, CF₄ or O₂.

The preparation provided by this embodiment will be illustrated below bytaking the substrate shown in FIG. 7A and FIG. 7C as an example.

For example, as shown in FIG. 8A, firstly, the base substrate 201 isprovided, and then the display region 20 and the peripheral region 21are formed in different regions of the base substrate 201. For example,the base substrate 201 adopts a glass substrate, a quartz substrate, aplastic substrate and the like, and the embodiments of the presentdisclosure do not make any specific limit to it.

For example, the driving circuit 202 for a plurality of pixel units inthe display region 20 is formed on the base substrate 201. For example,the driving circuit 202 includes the pixel driving circuit for the pixelunit, the pixel driving circuit includes structures such as a thin filmtransistor, a capacitor and the like, the driving circuit further mayinclude signal lines such as a gate line, a data line and the like andmay be formed by adopting a semiconductor preparation process, and theembodiments of the present disclosure do not make any limit to it.

For example, the first sub insulating layer 2031 is formed on thedriving circuit 202, and the step includes: forming a first subinsulation material layer on the driving circuit 202, and thenpatterning the first sub insulation material layer so as to form thefirst groove portion 2031A.

For example, the first sub insulating layer 2031 is formed by adopting anegative photoresist material and for example, adopting phenolic resinand the like. At the moment, the patterning the first sub insulationmaterial layer includes: exposing the first sub insulation materiallayer by a mask, and then performing development so as to form the firstgroove portion 2031A. The first groove portion 2031A is of a structurewith a narrow upper portion and a wide lower portion, and thus has alarger volume.

As shown in FIG. 8B, after the first sub insulating layer 2031 isformed, the second sub insulating layer 2032 may be formed on the firstsub insulating layer 2031, and the step includes: forming a second subinsulation material layer on the first sub insulating layer 2031, andthen patterning the second sub insulation material layer so as to formthe opening 2032A communicating with the first groove portion 2031A.

For example, the second sub insulating layer 2032 is formed by adoptinga positive photoresist material or an inorganic material and forexample, adopting the positive photoresist material such as polyimide,polyacrylate and the like, or the inorganic materials such as SiOx,SiNx, Al₂O₃ and the like. For example, when the second sub insulatinglayer 2032 is formed by adopting the positive photoresist material, thepatterning the second sub insulation material layer includes: exposingand developing the second sub insulation material layer by the mask soas to form the opening 2032A. When the second sub insulating layer 2032is formed by adopting the inorganic material, the patterning the secondsub insulation material layer includes: forming a layer of photoresiston the second sub insulation material layer, then exposing anddeveloping the photoresist by the mask so as to form a photoresistpattern, and then performing etching on the second sub insulationmaterial layer by the photoresist pattern so as to form the opening2032A; and the etching, for example, adopts a dry etching or a wetetching, and the embodiments of the present disclosure do not make anylimit to it. The first groove portion 2031A and the opening 2032Aconstitute the groove 203A in the insulating layer 203.

For example, the insulating layer 203 is configured that at least asurface in the peripheral region 21 is lyophobic. At the moment, thesecond sub insulating layer 2032 positioned at an upper portion of theinsulating layer 203 is formed by adopting a material with lyophobicity(for example, the materials illustrated above), or a surface of thesecond sub insulating layer 2032, which is positioned in the peripheralregion 21, is subjected to surface treatment, so that the surface of thesecond sub insulating layer 2032, which is positioned in the peripheralregion 21, is lyophobic.

For example, the surface of the second sub insulating layer 2032, whichis positioned in the peripheral region 21, may be subjected to a surfacetreatment by adopting plasmas of Ar, N₂, CF₄ or O₂, so that the surfaceof the second sub insulating layer 2032, which is positioned in theperipheral region 21, is lyophobic. For example, when the second subinsulating layer 2032 is formed by adopting the material withlyophobicity, different materials with lyophobicity have differentlyophobic degrees for different fluids formed thereon, and thus, thecorresponding materials may be selected as required; or, the surface ofthe second sub insulating layer 2032 formed by adopting the materialwith lyophobicity also may be subjected to lyophobic treatment so as tofurther improve lyophobicity of the surface of the second sub insulatinglayer 2032.

As shown in FIG. 8C, the light-emitting element layer 204 is formed on aportion of the insulating layer 203, which is positioned in the displayregion 20. For example, firstly, the first electrode 2041 is formed, thefirst electrode 2041 includes a plurality of sub electrodescorresponding to a plurality of pixel units; and then the pixeldefinition layer 2042 is formed, the pixel definition layer 2042includes a plurality of pixel openings 2042A respectively used for aplurality of pixel units, the plurality of pixel openings 2042Arespectively expose a plurality of sub electrodes of the first electrode2041, and the light-emitting layer 2043 is configured to at least covera plurality of pixel openings 2042A; and then the second electrode 2043and the passivation layer 2044 are formed on the light-emitting layer2043.

For example, the first electrode 2041 and the pixel definition layer2042 may be formed by adopting the patterning process, a material of thefirst electrode 2041, for example, includes metal oxide such as ITO, IZOand the like or metal such as Ag, Al, Mo and the like or alloy thereof,and a material of the pixel definition layer 2042, for example, includesan organic material such as polyimide and the like or an inorganicmaterial such as silicon oxide, silicon nitride and the like.

For example, the light-emitting layer 2043 may be formed by using aprinting mode such as ink-jet printing, spin-coating or spray-coatingand the like, and due to fluidity of printed ink, the material of theprinted light-emitting layer 2043 also extends into the groove 203A. Thematerial of the light-emitting layer 2043 is correspondingly selectedaccording to a type of a to-be-formed light-emitting element. Forexample, when an OLED is to be formed, an organic light-emittingmaterial is used, and the light-emitting layer may be a composite layerand for example, includes an electron injection sub layer, an electrontransport sub layer, a light-emitting sub layer, a hole transport sublayer, a hole injection sub layer and the like; and for further example,when the QLED is to be formed, a quantum dot light-emitting material isused. The embodiments of the present disclosure do not make any limit tothe material of the light-emitting layer. For example, the secondelectrode 2044 and the passivation layer 2045 may be formed by the maskrespectively in modes of evaporation, sputtering or deposition and thelike. For example, a material of the second electrode 2044 includesmetal such as Mg, Ca, Li or Al and the like or alloy thereof, or aninorganic material with conductivity, such as IZO, ZTO and the like, oran organic material with conductivity, such as (poly3,4-ethylenedioxythiophene/polystyrene sulfonate) (PEDOT/PSS) and thelike, and a material of the passivation layer 2045 includes an organicmaterial such as polyimide and the like or an inorganic material such assilicon oxide, silicon nitride and the like.

Further, an embodiment of the present disclosure further provides apreparation method of a display panel, including: manufacturing thesubstrate, the substrate being prepared by any one of theabove-mentioned preparation methods; and providing an opposed substrate,and bonding the opposed substrate on the display panel by a sealant,wherein the sealant covers the groove. For example, the preparationmethod is described with reference to the drawing, and as shown in FIG.8D, after the light-emitting element layer 204 is formed, thepreparation method of the display panel, after the preparation method ofthe substrate, further includes: providing the opposed substrate 205,and bonding the opposed substrate 205 on the substrate by the sealant206; for example, the sealant 206 is coated in the peripheral regionaccording to a preset pattern and covers the groove 203A so as to be atleast partially filled into and cover the groove 203A; and for example,according to a type of the sealant, the sealant may be subjected toultraviolet lighting curing or thermocuring. For example, a material ofthe opposed substrate 205 includes a glass plate, a plastic plate or aplastic film, for example, a plastic material may adopt a transparentmaterial such as polyethylene terephthalate (PET) or polyimide (PI) andthe like, and the material of the sealant 206 includes a material beingadhesive, such as resin and the like.

In some embodiments of the present disclosure, the groove 203A of theinsulating layer 203, which is positioned in the peripheral region 21,can collect the material of the light-emitting layer 2043 formed in theperipheral region 21 when the light-emitting element layer 204 isformed, and thus, for example, the undesired material cannot remain forexample on a portion of the insulating layer 203, which is positioned inthe peripheral region 21, and at the moment, the sealant 206 maydirectly bond the opposed substrate 205 with the insulating layer 203 soas to have a better packaging effect.

For example, in some embodiments, the second electrode 2044 and/or thepassivation layer 2044 also may be formed into one whole surface inmodes of evaporation, sputtering or deposition and the like, and at themoment, there is also a forming material of the second electrode 2044and/or the passivation layer 2044 in the groove 203A.

In some embodiments of the present disclosure, a portion of theinsulating layer 203, which is positioned in the peripheral region 21,has the groove 203A, and thus, the groove 203A can collect the undesiredmaterial formed on a portion of the insulating layer 203, which ispositioned in the peripheral region 21. As shown in FIG. 9, thepreparation method may be used for using one mother board andsimultaneously preparing a plurality of display panels by the motherboard, those display panels may be of the same shape or differentshapes, and then those display panels may be separated from each otherby a cutting process. For example, in FIG. 9, three display panels areprepared on the same mother board, and include an oval display panel onan upper side and two rectangular display panels on a lower side. Ineach display panel, the sealant 206 surrounds the display region 20 andcovers the groove in the peripheral region. For example, in someembodiments, the display panel also may be of an irregular shape, and atthe moment, even though one whole surface of functional layer, such asthe light-emitting layer 2043 and the like, is formed, due to acollection effect of the groove 203A, the material of the functionallayer such as the light-emitting layer 2043 and the like, for example,also cannot be remained on a portion of the insulating layer 203, whichis positioned in the peripheral region 21, so as not to influence thepackaging effect of the sealant 206. Therefore, the display panelprepared by the preparation method provided by the embodiments of thepresent disclosure has a better packaging effect, and a plurality ofdisplay panels can be simultaneously formed by utilizing the preparationmethod, thereby improving production efficiency.

At least one embodiment of the present disclosure further provides adisplay device. As shown in FIG. 10, a display device 300 includes anyone of the display panels provided by the embodiments of the presentdisclosure, and a display panel 200 is shown in the drawing. The displaydevice 300 may be any product or part with a display function, such as amobile phone, a tablet personal computer, a television, a display, anotebook computer, a digital photo frame, a navigator and the like, andthe embodiments of the present do not make any limit to it.

The following statements should be noted:

(1) The accompanying drawings involve only the structure(s) inconnection with the embodiment(s) of the present disclosure, and otherstructure(s) can be referred to common design(s).

(2) For the purpose of clarity only, in accompanying drawings forillustrating the embodiment(s) of the present disclosure, the thicknessof a layer or a region may be enlarged or reduced, that is, theaccompanying drawings are not drawn according to the actual scale.

(3) In case of no conflict, features in one embodiment or in differentembodiments can be combined to obtain a new embodiment.

What are described above is related to the specific embodiments of thedisclosure only and not limitative to the scope of the disclosure. Theprotection scope of the disclosure shall be based on the protectionscope of the claims.

This application claims priority to Chinese Patent Application No.201811496810.5 filed Dec. 7, 2018, the disclosure of which isincorporated herein by reference as part of the application.

The invention claimed is:
 1. A substrate, comprising a display regionand a peripheral region positioned in a periphery of the display regionand used for sealing, the substrate comprising: a base substrate; aninsulating layer, arranged on a side of the base substrate andpositioned in the display region and the peripheral region for sealing;and a plurality of pixel units, positioned on the insulating layercorresponding to the display region, a pixel definition layer,positioned on the insulating layer corresponding to the display regionand includes a plurality of pixel openings for defining the plurality ofpixel units, wherein in the peripheral region, at least one groove isdisposed on a side of the insulating layer which faces away from thebase substrate, a side of the groove which is away from the basesubstrate is open, and a depth direction of the groove is perpendicularto the base substrate, wherein the peripheral region for sealing is asealant set region, and each of the plurality of pixel units includes: alight-emitting element layer, arranged on a side of the insulating layerwhich faces away from the base substrate and including a light-emittinglayer, the light-emitting layer at least covering the plurality of pixelopenings, wherein an extending direction of the groove is identical withan extending direction of the pixel openings.
 2. The substrate accordingto claim 1, wherein an extending direction of the groove is parallel toa plane where the base substrate is positioned, and on a planeperpendicular to the base substrate, a longitudinal cross-section of thegroove is of a regular trapezoid or inverted trapezoid shape.
 3. Thesubstrate according to claim 1, wherein a shape and a size of an end ofthe groove away from the base substrate are identical with shapes andsizes of ends of the plurality of pixel openings away from the basesubstrate; or the shape of the end of the groove away from the basesubstrate is identical with the shapes of the ends of the plurality ofpixel openings away from the base substrate, the size of the end of thegroove away from the base substrate is greater than sizes of the ends ofthe plurality of pixel openings away from the base substrate.
 4. Thesubstrate according to claim 1, wherein the insulating layer includes aplurality of grooves in the peripheral region, each of plurality ofgrooves is one of the at least one groove, extending directions of theplurality of grooves are identical, the plurality of grooves arearranged into a plurality of rows and a plurality of columns in theperipheral region, a row direction of the grooves is identical with arow direction of the plurality of pixel openings, and a column directionof the grooves is identical with a column direction of the pixelopenings, wherein a shape of an end of the groove away from the basesubstrate is identical with shapes of ends of the plurality of pixelopenings away from the base substrate, sizes of the ends of theplurality of grooves away from the base substrate are equal to sizes ofthe ends of the plurality of pixel openings away from the basesubstrate, or the sizes of the ends of at least one portion of theplurality of grooves away from the base substrate are greater than thesizes of the ends of the plurality of pixel openings away from the basesubstrate.
 5. The substrate according to claim 4, wherein the sizes ofthe ends of the plurality of grooves away from the base substrate areequal to the sizes of the ends of the plurality of pixel openings awayfrom the base substrate, the shapes of the plurality of grooves areidentical and the sizes of the plurality of grooves are identical, apitch of the grooves in the row direction is identical with a pitch ofthe pixel openings in the row direction and/or a pitch of the grooves inthe column direction is identical with that of the pixel openings in thecolumn direction.
 6. The substrate according to claim 4, wherein theplurality of grooves are divided into two groups according to differentlengths, a width of each of the plurality of grooves is equal to a widthof the pixel opening, the length of a groove in one group of the twogroups is equal to a sum of pitches of the plurality of pixel openingsalong the column direction, the grooves in the one group of the twogroups are arranged on both sides of the display region along the rowdirection of the pixel opening, the length of a groove in other group ofthe two groups is equal to or greater than a length of each of theplurality of pixel openings, the grooves in the other group are arrangedon both sides of the display region in the column direction, and a pitchof the plurality of grooves along the row direction are identical withthe pitch of the plurality of pixel openings along the row direction. 7.The substrate according to claim 1, wherein a surface of the insulatinglayer which is positioned in the peripheral region has lyophobicity. 8.The substrate according to claim 1, wherein at least one portion of thelight-emitting layer is positioned in the groove.
 9. The substrateaccording to claim 1, wherein the insulating layer includes: a first subinsulating layer, having a first groove portion; and a second subinsulating layer, laminated on the first sub insulating layer and havingan opening communicating with the first groove portion, the first grooveportion and the opening constituting the groove.
 10. The substrateaccording to claim 9, wherein a longitudinal cross-section of the firstgroove portion is of a regular trapezoid shape, and a longitudinalcross-section of the opening is of an inverted trapezoid or rectangleshape, wherein a material of the first sub insulating layer includes anegative photoresist material, and a material of the second subinsulating layer includes a positive photoresist material or aninorganic material.
 11. A display panel, comprising: the substrateaccording to claim 1; an opposed substrate, arranged to be opposite tothe substrate; and a sealant, disposed between the substrate and theopposed substrate, wherein the sealant covers the groove and bonds theopposed substrate with the substrate.
 12. A preparation method formaking the display panel according to claim 11, comprising:manufacturing the substrate, the substrate including a display regionand a peripheral region which is positioned in a periphery of thedisplay region and used for sealing, the manufacturing the substratecomprising: providing a base substrate; forming an insulating layer inthe display region and the peripheral region and on a side of the basesubstrate; and forming at least one groove in the peripheral region andon a side of the insulating layer that faces away from the basesubstrate, a side of the groove away from the base substrate being open,a depth direction of the groove being perpendicular to the basesubstrate, wherein the substrate includes a plurality of pixel units,and the plurality of pixel units are positioned on the insulating layercorresponding to the display region; and providing an opposed substrate,and bonding the opposed substrate on the substrate by a sealant, whereinthe sealant covers the groove.
 13. A display device, comprising thedisplay panel according to claim
 11. 14. A preparation method of asubstrate, the substrate including a display region and a peripheralregion which is positioned in a periphery of the display region and usedfor sealing, the preparation method comprising: providing a basesubstrate; forming an insulating layer in the display region and theperipheral region and on a side of the base substrate; and forming atleast one groove in the peripheral region and on a side of theinsulating layer that faces away from the base substrate, a side of thegroove away from the base substrate being open, a depth direction of thegroove being perpendicular to the base substrate, wherein the substrateincludes a plurality of pixel units, and the plurality of pixel unitsare positioned on the insulating layer corresponding to the displayregion, wherein the preparation method of the substrate furthercomprises: forming a pixel definition layer, the pixel definition layerincluding a plurality of pixel openings respectively used for theplurality of pixel units; and forming a light-emitting layer, thelight-emitting layer at least covering the plurality of pixel openings,wherein the light-emitting layer is formed by using an ink-jet printing,spin-coating or spray-coating mode, and at least one portion of thelight-emitting layer is formed in the groove.
 15. The preparation methodaccording to claim 14, wherein the forming the insulating layerincludes: forming a first sub insulating layer, the first sub insulatinglayer having a first groove portion; and forming a second sub insulatinglayer on the first sub insulating layer, the second sub insulating layerhaving an opening communicating with the first groove portion, whereinthe first groove portion and the opening constitute the groove.
 16. Thepreparation method according to claim 15, wherein the second subinsulating layer is formed by adopting a material with lyophobicity, ora surface of the second sub insulating layer which is positioned in theperipheral region is subjected to surface treatment, so that the surfaceof the second sub insulating layer which is positioned in the peripheralregion has lyophobicity.
 17. The preparation method according to claim16, wherein the surface treatment is carried out by adopting plasmas ofAr, N₂, CF₄ or O₂.
 18. A substrate, comprising a display region and aperipheral region positioned in a periphery of the display region andused for sealing, the substrate comprising: a base substrate; aninsulating layer, arranged on a side of the base substrate andpositioned in the display region and the peripheral region for sealing;and a plurality of pixel units, positioned on the insulating layercorresponding to the display region, wherein in the peripheral region,at least one groove is disposed on a side of the insulating layer whichfaces away from the base substrate, a side of the groove which is awayfrom the base substrate is open, and a depth direction of the groove isperpendicular to the base substrate, wherein a surface of the insulatinglayer which is positioned in the peripheral region has lyophobicity. 19.The substrate according to claim 18, wherein the peripheral region forsealing is a sealant set region, and each of the plurality of pixelunits includes: a light-emitting element layer, arranged on a side ofthe insulating layer which faces away from the base substrate andincluding a light-emitting layer.
 20. The substrate according to claim19, wherein at least one portion of the light-emitting layer ispositioned in the groove.